NEXA XFluor® perfluoroelastomers for semiconductor applications are engineered to reduce contamination and guarantee longer seal life in aggressive wafer manufacturing environments.
The success of NEXA XFluor® has been field-proven in the manufacture of semiconductors, where processing steps require: high purity, reduced contamination for particulates, resistance to both thermal and chemical exposure that could cause seal deterioration. With NEXA XFluor®, manufacturers gain seal integrity, process purity and, ultimately, high semiconductor wafer yield.
Chemical resistance that is nearly universal, coupled with superior high-temperature properties, enables NEXA XFluor® parts to withstand virtually any process media, including plasma with various gases at temperatures up to 345°C (653F).
By selecting the NEXA XFluor® part that is best suited to a specific application, processors can improve seal performance in all wafer-fabricating operations including thermal, gas deposition, plasma etching and ashing, and wet chemical systems.
NEXA R&Ds latest achievement consists in an innovative chemical resistant perfluoroelastomer filled with a special semi-crystalline perfluoropolymer filler that allows the manufacturing of translucent items with excellent properties.
Some of its unique properties:
Temperature range: -8°C to +260°C
General purpose applications
Temperature range: -8°C to +250°C
Excellent Plasma resistance
Minimal contamination
Very good physical properties
Low metal ions content
Temperature range: -7°C to +320°C
Innovative plasma resistance shielding
Plasma and Gas depositions processes
We would be happy to discuss your sealing requirements and answer any question and inquiries.
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